At ESEC 2009, VIA will reveal game-changing digital signage technology for efficient HD content delivery on multiple displays
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced it will showcase a forthcoming, digital signage solution for multi screen HD content at Booth No. 28-33, East Wing of Embedded Systems Expo (ESEC), which will be held in Tokyo, Japan from May 13-15.
Visitors to ESEC 2009 will see a platform that features dual HDMI connectors and an onboard DX10.1 capable graphics processor from S3 Graphics. Powering up to four digital displays of glorious HD content, the latest Mini-ITX board from VIA eliminates the need for an additional graphics card, offering an affordable solution that can be brought to market faster, without requiring expensive and time consuming software customization.
“Our digital signage solution represents a new approach to HD content delivery, both in terms of ROI and speed to market,” said Daniel Wu, Vice President of VIA Embedded, VIA Technologies, Inc. “VIA’s long term strategy is to re-invigorate existing markets with innovative products and services that continue to give our customers the edge in a competitive market place.”
Next-Generation Systems and Services from VIA at ESEC
Join VIA at Embedded Systems Expo, Tokyo and see why VIA is leading the pack with innovative small form factor designs and system level design manufacturing services.
VIA’s expertise in small factor industrial PC design will be shown in the form of the VIA AMOS-3000, a versatile, fanless, ultra compact industrial PC based on the VIA EPIA P700 Pico-ITX form factor board. Ideal for a variety of industrial applications, the VIA AMOS-3000 is constructed from heavy-duty steel, aluminum and copper for superb heat dissipation and stability in always-on industrial environments.
System level products on display include the VIA VIPRO VP7710 panel PC for kiosk, POI and HMI applications; a fanless and rugged industrial grade touch screen panel PC featuring a water and dust resistant 10.4″ TFT LCD touch screen panel.
VIA will also showcase products using the latest VIA developed Em-ITX and Pico-ITXe form factors. The VIA EITX-3000 board takes advantage of the latest Em-ITX form factor specification, adding longer dual I/O coastlines to provide ample space for a wide array of I/O options. Designed for ultra-thin embedded applications, the VIA EITX-3000 can withstand a wide range of temperatures and features a 1.3GHz VIA Nano processor.
Visitors to ESEC 2009 will also be able to see the first Pico-ITXe based product on the market, the VIA EPIA-P710. Using SUMIT connectors to mount customized expansion boards in a stackable, I/O-centric implementation, the VIA EPIA-P710 is perfect for a wide range of small form factor embedded applications.
For more details about VIA’s involvement at ESEC 2009, please visit:
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw
Source: VIA Technologies